Job Description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR57441 Package Design Engineer
Responsibilities will include, but are not limited to:
Package design execution of DRAM designs on time with 100% quality.
Support design of highly integrated packages for optimal electrical performance, manufacturability, and reliability and to reduce Turnaround time. Work with customers, internal process design teams, OSATs, and other ecosystem partners.
Driving innovations into the future memory generations within dynamic work environment.
Support set up of designs, rules, and routing methodologies for advanced processes.
Support package and DFMEA reviews with assembly engineering and subcon teams.
Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
Work with SBT (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements with packaging solutions.
Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
Support a data driven culture, operational excellence and establishing processes and operational metrics.
Lead package and DFM (Design for Manufacturing) reviews and design setup.
Engage with key Business Unit (BU) customers and assembly subcontractor partners to propose package solutions that meet customer and/or market needs.
Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
Track and drive program landmarks to ensure timely development execution.
Support packaging IP (Intellectual Property) development.
Provide design support for thermal/mechanical/electrical simulation analysis.
Support and supply to the design group’s continuous improvement efforts such as:Global design alignment activitiesPackage design rules and system developmentPackage roadmapsCompetitive Analysis review
Qualifications
Mtech in electrical engineering (preferred), Electronics or a related field that covers a wide range of topics in mechanical engineering, materials science, or other interdisciplinary areas.
Three or more years (preferably 5+ years) of industry experience within the following areas:Advanced Memory Substrate Design for flip chip and wire bond interconnectsDesign optimization for Signal and Power IntegrityCadence (Allegro Package Designer+), Siemens/MentorGraphics (Xpedition tool suite)AutoCAD (Autodesk Mechanical) toolsChip Package Interaction (CPI)
Outstanding computer skills and MS Office competence.
A keen eye for detail and accuracy.
Effective interpersonal skills, both oral and written.
A global perspective and the ability to work in a multicultural environment.
Ability to prioritize and manage numerous projects successfully.
Willingness to travel as needed.
